Nanonex Resists/Material Family

Nanomprintor Thermoplastic and Thermal Curable Resists

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• Sub-10 nm resolution and wafer-scale uniformity

• Ultra-fast response and excellent flow

• Low processing temperature and pressure

• Strong adhesion to substrates

• Stable at room temperature

• Suitable for direct etching and lift-off

Photo-Curable Resists

 

• Sub-5 nm demonstrated resolution and wafer-scale uniformity

• Room temperature operation

• Super-low viscosity

• Spin-on or resist-drop dispensing

• Excellent etching resistance

• Low UV-curing dosage

Underlayer Resists

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• Optimizing direct etching and lift-off processes

• Excellent thermal stability

• Easy handling and processing

• Planarizing sample surfaces

• Strong adhesion to top layer resists and substrates

Mold Materials

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• Easy mold formation with one-step imprint

• Photo-curable

• Strong and durable when cured

• Stable mechanical and chemical properties

Surfactants for Nanoimprint

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• Ensuring reliable mold-resist separation

• Promoting adhesion between resists and substrates

• Easy handling and processing

• Stable properties after treatment