Engine for Nanotechnology™
Key Features
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Nanoimprint Forms: Thermal nanoimprint, Photocurable/UV nanoimprint, Simultaneous Thermal and UV-curable NIL, Embossing
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Air Cushion Press™ (ACP): Patented technology, excellent uniformity over the entire substrate, high throughput, and offers great protection to mold and substrate
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High-Fidelity Flexible Mold (HiF2M) compatible
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Flexibility: Smart Sample Holder (SSH) handles Irregular Substrate Shapes and Sizes up to 12” Diameter
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Sub 10 nm Resolution
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Fast Cycle Time: Fast Radiant Heating (FRH), and low thermal mass enable fast imprint cycle time
System Specifications
Thermal Plastic Imprint Module
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Temperature Range of ambient to up to 250°C
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Heating Rate up to 300 °C/minute
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Cooling Rate up to 150 °C/minute
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Pressure Range: up to 3.8 MPa (550 psi)
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Photocuring Module
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Integrated UV LED source
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365 nm or 395 nm +/- 15 nm wavelength
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Up to 2000 hours lifetime LED
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Automatic Control
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Photolithography Module
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Mercury UV source for uniform exposure
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Wavelength: 350 nm to 450 nm
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Resolution: down to 1 µm
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Alignment Module
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X, Y, Z, θ stage
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Split field optics and CCD cameras
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Live view & adjustment upon mold substrate contact
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Alignment Method: Top Side Alignment (TSA); Back Side Alignment (Optional)
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Substrate Handling
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Maximum 12-inch Diameter (4'', 6'', 8'', 12'' available)
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Unique Ability to Handle Irregular Shapes and Sizes Standard
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ACP is ideal for fragile substrates such as GaAs or InP
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Machine Footprint
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31" x 87" (787 mm by 2210mm)